Overview of aluminum nitride ceramics

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of aluminum nitride ceramics

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(Cu Coating Aluminium Nitride AlN Ceramic Substrate)

Specifications of Cu Coating Aluminium Nitride AlN Ceramic Substrate

The Cu Coating Aluminium Nitride (AlN) Ceramic Substratum uses high performance for innovative electronic applications. The base material is aluminium nitride ceramic, recognized for excellent thermal conductivity. This substrate gets to a thermal conductivity value of 170-200 W/mK. It effectively moves warm away from sensitive elements. The copper finishing layer is used utilizing direct bonding or magnetron sputtering. The copper layer thickness varies from 0.1 mm to 0.5 mm. This makes certain strong attachment and reliable electric connectivity.

The substrate operates in temperature levels from -50 ° C to 850 ° C. It keeps stability under extreme thermal cycling. The surface area roughness of the ceramic layer is listed below 0.4 μm. This smooth surface area supports accurate circuit patterning. The dielectric stamina surpasses 15 kV/mm. It avoids electrical malfunction in high-voltage atmospheres.

Criterion dimensions include thicknesses of 0.5 mm, 1.0 mm, and 1.5 mm. Customized dimensions are offered for certain design demands. The copper-coated surface area can be pre-treated with oxidation resistance coverings. This expands the substratum’s life expectancy in damp or harsh conditions.

The coefficient of thermal expansion (CTE) matches typical semiconductor materials like silicon. This lowers stress at material user interfaces during temperature changes. The substrate’s flexural stamina mores than 300 MPa. It resists mechanical contortion under lots.

Applications consist of power modules, LED product packaging, and RF gadgets. It fits high-frequency circuits because of reduced signal loss. The copper layer permits soldering or cable bonding. This streamlines combination into existing electronic assemblies.

Aluminium nitride ceramics are non-toxic and RoHS-compliant. They fulfill market requirements for ecological safety and security. Checking information validates integrity under extended thermal and electric stress. Performance uniformity is assured throughout manufacturing batches.

The Cu Finishing AlN Ceramic Substratum equilibriums thermal management, electric insulation, and mechanical resilience. It resolves obstacles in miniaturized, high-power electronic devices. Customizable options make sure compatibility with diverse design requirements.

(Cu Coating Aluminium Nitride AlN Ceramic Substrate)

Applications of Cu Coating Aluminium Nitride AlN Ceramic Substrate

Cu layer aluminium nitride (AlN) ceramic substrates combine high thermal conductivity with solid electric insulation. This makes them optimal for innovative electronics. AlN ceramics relocate warm effectively. Including a copper layer boosts warmth transfer further. It also allows reliable electrical connections. These residential properties address difficulties in high-performance gadgets.

One major use remains in LED illumination systems. High-power LEDs create considerable warmth. Cu layered AlN substrates manage this heat effectively. They stop getting too hot. This guarantees steady light output. It expands the life-span of LED components.

Power electronic devices benefit considerably. Gadgets like IGBTs and MOSFETs require effective air conditioning. Cu layered AlN substratums manage high thermal tons. They keep efficiency in inverters and converters. This is important for industrial equipment and renewable energy systems.

RF and microwave applications depend on these substrates. Signal loss have to remain reduced at high regularities. The material’s electrical insulation lowers disturbance. Its thermal properties stop damage from heat buildup. This is vital for interaction systems and radar innovation.

Electric automobiles make use of Cu coated AlN in battery monitoring and electric motor drives. Efficient warm dissipation secures sensitive parts. It sustains quick billing systems. This boosts car reliability and safety and security.

Aerospace applications require materials that perform under extreme problems. Cu covered AlN substrates take care of thermal anxiety in avionics and satellite systems. Their light-weight nature lowers general devices weight. This is important for gas effectiveness and objective success.

Semiconductor product packaging uses these substratums for chip defense. They shield circuits from warmth and electrical sound. This enhances processing rate and tool resilience. It sustains innovations in computer and data storage.

Clinical tools call for precision and dependability. Cu layered AlN substrates guarantee steady operation in imaging systems and medical tools. They stop overheating in portable, high-power medical devices.

Renewable resource systems like solar inverters depend on these substratums. They take care of heat in high-voltage environments. This enhances power conversion effectiveness. It supports lasting power generation.

Cu coated AlN ceramic substrates adjust to varied industries. Their unique properties attend to contemporary technology demands. They allow smaller, much faster, and a lot more dependable electronic remedies.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.(nanotrun@yahoo.com)

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T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Cu Coating Aluminium Nitride AlN Ceramic Substrate

1. What is copper coating on aluminium nitride ceramic substrate? Copper coating involves applying a layer of copper to the surface of aluminium nitride (AlN) ceramic. This process improves electrical conductivity while keeping the ceramic’s high thermal performance. AlN ceramic alone is an electrical insulator. Adding copper allows it to work in circuits or devices needing both heat management and electrical connections. The coating is usually done through methods like electroplating or direct bonding.

2. Why choose copper-coated AlN over other materials? AlN ceramic has excellent thermal conductivity, around 170-200 W/mK. Copper coating adds electrical conductivity without blocking heat transfer. Materials like aluminum oxide or regular PCB substrates have lower thermal performance. Copper-coated AlN handles high-power and high-frequency applications better. It reduces overheating risks in electronics.

3. Does the copper layer affect thermal conductivity? The copper layer does not lower the AlN’s thermal conductivity. Heat flows through the ceramic efficiently even with the coating. Copper spreads heat evenly across the surface. This prevents hot spots. The bond between copper and AlN must be strong to avoid delamination, which could disrupt heat transfer.

4. Where is copper-coated AlN substrate commonly used? It is used in high-power electronics like LED modules, RF devices, and power converters. Automotive systems like EV battery controls rely on it for heat dissipation. Telecom infrastructure and aerospace electronics use it for stable performance under extreme conditions.

5. How to handle copper-coated AlN substrates safely? Avoid scratching the copper layer during installation. Clean surfaces with mild solvents to remove dust or oils. Do not expose it to sudden temperature changes. Store in dry environments to prevent oxidation of the copper. Use compatible soldering materials to avoid damaging the coating.

(Cu Coating Aluminium Nitride AlN Ceramic Substrate)