Overview of aluminum nitride ceramics

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of aluminum nitride ceramics

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(AlN Aluminum Nitride Ceramic Thermal Pads for MOSFET Transistor IGBT Transistor Heat Sink)

Specifications of AlN Aluminum Nitride Ceramic Thermal Pads for MOSFET Transistor IGBT Transistor Heat Sink

AlN light weight aluminum nitride ceramic thermal pads handle warm transfer in MOSFET transistors, IGBT transistors, and warm sinks. These pads make use of high-purity light weight aluminum nitride material. The thermal conductivity gets to 170-180 W/mK. This performance relocates warm far from electronic components quickly. It keeps tools running at steady temperature levels. The pads work in temperatures from -50 ° C to 800 ° C. They remain trustworthy in severe conditions.

The material stands up to chemical rust. It does not react with oils, solvents, or dampness. This prevents damage with time. The pads have strong dielectric stamina. They insulate electrically even under high voltages. This cuts short circuits. It protects sensitive parts in power electronic devices.

Requirement density ranges from 0.3 mm to 10mm. Custom sizes fit specific designs. The surface area is smooth. It produces limited call with heat resources and sinks. Air spaces shrink. Warmth actions efficiently. Setup is straightforward. No adhesives or added layers are needed.

These ceramic pads change standard materials like silicone or mica. They last longer. They don’t dry or fracture. Mechanical stamina is high. The pads manage stress during assembly. They stay undamaged under vibration.

AlN ceramic pads suit electrical cars, commercial motor drives, solar inverters, and power products. They cool down high-power semiconductors effectively. Performance remains regular over time. Maintenance requires decline.

The pads are available in flat sheets or pre-cut forms. They match common transistor and warm sink sizes. Custom designs are available. Preparations are short for bulk orders.

Aluminum nitride is safe. It fulfills RoHS and REACH criteria. It is safe for electronics and the environment. No damaging gases launch during use.

These thermal pads reduce gadget failure threats. They extend the lifespan of power components. Power losses from overheating decline. Systems run much more successfully. Prices lower for repair work and replacements.

The product is light-weight. It includes minimal mass to arrangements. Space-saving layouts stay portable. Heat administration enhances without added weight.

(AlN Aluminum Nitride Ceramic Thermal Pads for MOSFET Transistor IGBT Transistor Heat Sink)

Applications of AlN Aluminum Nitride Ceramic Thermal Pads for MOSFET Transistor IGBT Transistor Heat Sink

AlN light weight aluminum nitride ceramic thermal pads are essential for handling heat in MOSFET and IGBT transistors. These pads transfer heat from transistors to warmth sinks successfully. High-power electronics create substantial warm during procedure. Excess warm reduces performance and reduces component lifespan. AlN ceramic pads fix this problem successfully.

MOSFET and IGBT transistors are commonly used in industrial equipment, auto systems, and renewable resource setups. These applications require dependable thermal management. AlN ceramic thermal pads succeed here. They have high thermal conductivity, around 170-200 W/mK. This value surpasses typical products like alumina or silicone pads. Heat relocations swiftly from the transistor to the warmth sink.

Electrical insulation is another essential feature. AlN pads prevent electrical leak between transistors and warmth sinks. Safety threats and circuit failures are lessened. The material stands up to high voltages without breaking down. This dependability makes certain secure procedure popular settings.

Longevity matters in commercial setups. AlN ceramic withstands thermal shock and chemical corrosion. Temperature fluctuations in power electronic devices cause tension. AlN pads deal with rapid heating and cooling without fracturing. Severe chemicals in making settings do not degrade them. Long-term efficiency continues to be constant.

Mechanical stability ensures correct contact in between components. AlN pads maintain their shape under pressure. Gaps or uneven surface areas minimize warmth transfer effectiveness. These pads get rid of such problems. Transistors remain cooler, improving system integrity.

Portable layouts benefit from AlN pads. They are slim and lightweight. Space-saving solutions are vital in modern-day electronic devices. Warm sinks can be smaller without sacrificing cooling capability. Device dimension and weight reductions are achievable.

Automotive applications like electrical lorries rely on effective power components. AlN pads take care of heat in onboard chargers and inverters. Overheating dangers in high-current scenarios are minimized. Renewable resource systems like solar inverters also use these pads. Consistent cooling makes certain optimum energy conversion performance.

Industrial electric motor drives and power materials face comparable challenges. AlN ceramic thermal pads give a reliable remedy. Heat dissipation is enhanced. Element long life and system uptime enhance.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.(nanotrun@yahoo.com)

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T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of AlN Aluminum Nitride Ceramic Thermal Pads for MOSFET Transistor IGBT Transistor Heat Sink

AlN aluminum nitride ceramic thermal pads handle heat in MOSFET and IGBT transistors. People ask questions about these pads. Here are answers.

What makes AlN ceramic pads better than others?
Aluminum nitride transfers heat fast. It has high thermal conductivity. This keeps transistors cool. Other materials like silicone or rubber work slower. AlN pads move heat away quickly. This stops parts from overheating.

Do these pads handle high temperatures?
Yes. AlN ceramic works in extreme heat. It stays stable from -40°C to 1200°C. Most plastics or rubbers melt or crack here. These pads stay strong. They fit power devices that run hot.

How long do AlN thermal pads last?
They last years. Ceramic resists wear. Heat cycles or pressure won’t break them. Silicone degrades faster. AlN keeps performing. No need to replace often.

Are these pads electrically insulating?
Yes. AlN blocks electricity. It stops shorts between transistors and heat sinks. Even with high voltage, it stays safe. No extra insulation layers are needed.

Can I cut or shape the pads?
Yes. Trim them to fit your device. Use tools for ceramics. Be careful. Rough edges might reduce contact. Smooth cuts work best. Some suppliers offer custom sizes.

These points cover basics. AlN pads cool efficiently, last long, and prevent electrical issues. They suit high-power electronics needing reliable heat control.

(AlN Aluminum Nitride Ceramic Thermal Pads for MOSFET Transistor IGBT Transistor Heat Sink)