Overview of aluminum nitride ceramics

Aluminum Nitride Ceramic is an advanced ceramic material with aluminum nitride as the main component. It has been widely used in electronics, optics, and mechanics due to its unique properties.

Features of aluminum nitride ceramics

High thermal conductivity: Aluminum nitride ceramics have relatively high thermal conductivity, usually between 170-260 W/m·K, which makes it an excellent heat dissipation material. It is especially suitable for electronic devices that require efficient heat dissipation, such as substrate materials for power semiconductor devices.

Good electrical insulation: Despite its high thermal conductivity, aluminum nitride ceramics are excellent insulators of electricity, which can effectively prevent current leakage and ensure the safe operation of electronic components.

Low dielectric constant and dielectric loss: These characteristics make aluminum nitride ceramics very suitable for use in high-frequency circuits because it can reduce energy loss during signal transmission.

High temperature resistance: Aluminum nitride ceramics can maintain structural stability and strength at extremely high temperatures. Its melting point is about 2800°C, so it is suitable for applications in high temperature environments.

Low thermal expansion coefficient: Compared with semiconductor materials such as silicon, aluminum nitride has a lower thermal expansion coefficient, which means it has better dimensional stability when the temperature changes, which helps improve packaging reliability.

Corrosion resistance: Aluminum nitride ceramics have good chemical stability to most molten metals and are not easily oxidized or corroded, allowing them to perform well in harsh environments.

High mechanical strength: Although not as hard as some other types of ceramic materials, aluminum nitride ceramics still provide enough mechanical strength to allow them to be used in many structural applications.

(Hot ing Alumina Nitride Sheet Substrate Wafer Aluminum Nitride Ceramic Substrate Aln Wafer)

Specifications of Hot ing Alumina Nitride Sheet Substrate Wafer Aluminum Nitride Ceramic Substrate Aln Wafer

The Hot Pushed Alumina Nitride Sheet Substrate Wafer is a high-performance ceramic product created for sophisticated commercial applications. It integrates outstanding thermal conductivity with strong electric insulation, making it excellent for use sought after digital settings. The material provides a thermal conductivity ranking of 170-220 W/m · K, making certain efficient heat dissipation in high-power devices. Its reduced thermal development coefficient carefully matches materials like silicon, reducing anxiety and enhancing dependability in temperature-sensitive applications.

This aluminum nitride ceramic substratum runs effectively in temperature levels as much as 1400 ° C, preserving architectural security under extreme warm. The wafer provides exceptional resistance to chemical rust, plasma erosion, and use, guaranteeing long-lasting resilience. Its high purity (over 99% AlN content) reduces contamination dangers in accuracy procedures.

Standard density ranges from 0.3 mm to 15mm, with diameters readily available from 10mm to 500mm. Customized sizes and shapes can be made to fulfill certain needs. The surface area coating options consist of polished, washed, or as-sintered surfaces, satisfying various bonding and finish requirements.

The AlN wafer features remarkable dielectric stamina, surpassing 15 kV/mm, making it suitable for high-voltage applications. Its safe make-up complies with RoHS and REACH ecological requirements. The product’s mechanical strength continues to be constant throughout large temperature varieties, protecting against contortion throughout thermal biking.

Applications include power electronics, LED components, semiconductor manufacturing devices, and RF/microwave parts. It acts as a reliable option to beryllium oxide porcelains, removing poisoning worries while preserving efficiency. The substrate incorporates effortlessly with straight bond copper (DBC) and thin film modern technologies for circuit integration.

Production utilizes warm pushing methods to attain thick, pore-free frameworks with uniform grain circulation. X-ray fluorescence testing and ultrasonic inspection ensure product consistency and defect-free surface areas. Limited resistances ( ± 0.1 mm density, ± 0.5 mm diameter) fulfill accuracy design criteria.

Product packaging includes vacuum-sealed anti-static containers to avoid dampness absorption and surface area contamination during storage and transportation. Technical support is offered for thermal management options and application-specific design optimizations.

(Hot ing Alumina Nitride Sheet Substrate Wafer Aluminum Nitride Ceramic Substrate Aln Wafer)

Applications of Hot ing Alumina Nitride Sheet Substrate Wafer Aluminum Nitride Ceramic Substrate Aln Wafer

Hot-pressed light weight aluminum nitride (AlN) ceramic substrate wafers offer vital roles throughout markets due to their one-of-a-kind properties. These substratums handle high thermal conductivity, electrical insulation, and resistance to severe temperature levels. Their efficiency makes them perfect for sophisticated applications where integrity matters.

In electronics, AlN wafers serve as base products for semiconductor tools. They transfer heat efficiently from high-power elements like LEDs, laser diodes, or RF modules. This stops overheating, boosts device lifespan, and ensures secure operation. AlN’s low thermal development matches materials like silicon, lowering stress in split styles.

The auto market makes use of AlN substratums in electrical car power systems. They handle heat in inverters, electric motor controllers, and battery components. High thermal conductivity aids maintain ideal temperature levels, improving performance and safety. AlN’s electric insulation prevents brief circuits in high-voltage settings.

Aerospace applications depend on AlN for radar systems and satellite communication devices. The product stands up to fast temperature changes and rough problems without degrading. Its light-weight nature fits space-constrained designs.

AlN ceramic substrates support high-frequency circuits in telecoms. They decrease signal loss in 5G facilities and microwave devices. The material’s security at high regularities makes certain clear data transmission.

Industrial heating unit utilize AlN sheets as insulators or heat spreaders in furnaces and sensing units. They withstand harsh environments and thermal shocks. This reduces upkeep requirements in demanding environments.

LED producers select AlN wafers for high-brightness lights solutions. Efficient heat dissipation permits LEDs to operate at greater power without color changes. This extends the life of illumination systems in business or outside setups.

Power electronic devices rely on AlN substrates for shielded gate bipolar transistors (IGBTs) and thyristors. Reliable warm management below prevents failures in energy grids or renewable resource systems.

Medical tools integrates AlN in imaging tools and surgical tools. The material’s biocompatibility and thermal homes make certain accuracy in delicate applications.

Company Introduction

Advanced Ceramics founded on October 17, 2014, is a high-tech enterprise committed to the research and development, production, processing, sales and technical services of ceramic relative materials and products.. Since its establishment in 2014, the company has been committed to providing customers with the best products and services, and has become a leader in the industry through continuous technological innovation and strict quality management.

Our products includes but not limited to Silicon carbide ceramic products, Boron Carbide Ceramic Products, Boron Nitride Ceramic Products, Silicon Carbide Ceramic Products, Silicon Nitride Ceramic Products, Zirconium Dioxide Ceramic Products, Quartz Products, etc. Please feel free to contact us.(nanotrun@yahoo.com)

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T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Hot ing Alumina Nitride Sheet Substrate Wafer Aluminum Nitride Ceramic Substrate Aln Wafer

What is a hot-pressed aluminum nitride sheet substrate wafer used for?
Hot-pressed aluminum nitride (AlN) sheet substrate wafers are mainly used in electronics. They work as base materials for circuits in high-power devices. These wafers handle heat well. They are ideal for LED lighting, semiconductor modules, and radio-frequency applications. Their high thermal conductivity helps move heat away from sensitive parts. This prevents overheating and improves device performance.

Why choose aluminum nitride over other ceramics?
Aluminum nitride has better thermal conductivity than most ceramics. It moves heat 10 times faster than alumina. This makes it perfect for devices needing quick heat dissipation. Aluminum nitride also resists chemical corrosion. It stays stable in harsh environments. Its electrical insulation properties are strong. This reduces energy loss in high-frequency applications.

How does aluminum nitride handle high temperatures?
Aluminum nitride works reliably in temperatures up to 1400°C. It does not melt or degrade easily under heat. This makes it suitable for aerospace and automotive industries. It handles sudden temperature changes without cracking. This thermal shock resistance ensures long-lasting performance in extreme conditions.

Can aluminum nitride substrates be customized?
Yes. Manufacturers offer custom sizes, shapes, and thicknesses. Surface finishes can be adjusted for specific bonding needs. Holes or patterns are added based on circuit designs. Customization ensures compatibility with different devices. Production times vary depending on complexity.

Are there limits to using aluminum nitride substrates?
Aluminum nitride is more expensive than alumina or aluminum oxide. Costs might be high for budget-sensitive projects. Machining finished wafers requires specialized tools. Improper handling can cause chipping or cracks. It is less effective in applications needing electrical conductivity. Proper design checks are necessary to avoid compatibility issues.

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